专利名称：Packaging of a microchip device发明人：Wang Chuen Khiang申请号：US11534034申请日：20060921公开号：US07504715B2公开日：20090317
专利附图：
摘要：The present invention is directed to an interposer for packaging a microchipdevice, which includes a plurality of electrical contacts on an outer side of the interposer,for electrically contacting the packaged microchip device and to be electrically
connected with the microchip device. There is an aperture extending from the outer side
into the interposer. The aperture may be divided into at least two openings, and at leasta first of the openings may extend from the outer side through the interposer in order toallow connection to the microchip device.
申请人：Wang Chuen Khiang
地址：Singapore SG
国籍：SG
代理机构：Greenblum & Bernstein, P.L.C.
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