专利名称：Apparatus and method for fluxless
soldering
发明人：Hung N. Nguyen申请号：US08/267053申请日：19940627公开号：US05478005A公开日：19951226
摘要：For soldering together two surfaces of a workpiece by means of solder, andwithout the use of a solder flux, apparatus includes means for preheating the workpieceand solder to a temperature close to but less than the solder fusing temperature, andmeans for directing two jets of a hot, non-oxidizing gas towards the preform fromopposite sides thereof and along a straight line axis. The hot gas melts the solder andcauses flow of the melted solder between the two surfaces in directions generallytransverse to the axis of the two gas jets.
申请人：AT&T CORP.
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