专利名称：Sputtering Cathode, Sputtering Cathode
Assembly, and Sputtering Apparatus
发明人：Hiroshi Iwata申请号：US17030109申请日：20200923
公开号：US20210005438A1公开日：20210107
专利附图：
摘要：The sputtering cathode has a tubular shape having a pair of long sides facingeach other in cross-sectional shape, has a sputtering target whose erosion surface facesinward, and a magnetic circuit is provided along the sputtering target. The pair of long
sides are constituted by rotary targets each having a cylindrical shape. The rotary targetis internally provided with a magnetic circuit and configured to allow the flow of coolingwater. The magnetic circuit is provided parallel to the central axis of the rotary targetand has a rectangular cross-sectional shape having a long side perpendicular to the radialdirection of the rotary target.
申请人：Keihin Ramtech Co., Ltd.
地址：Kamakura-shi JP
国籍：JP
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