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Sputtering Cathode, Sputtering Cathode Assembly, a

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专利名称:Sputtering Cathode, Sputtering Cathode

Assembly, and Sputtering Apparatus

发明人:Hiroshi Iwata申请号:US17030109申请日:20200923

公开号:US20210005438A1公开日:20210107

专利附图:

摘要:The sputtering cathode has a tubular shape having a pair of long sides facingeach other in cross-sectional shape, has a sputtering target whose erosion surface facesinward, and a magnetic circuit is provided along the sputtering target. The pair of long

sides are constituted by rotary targets each having a cylindrical shape. The rotary targetis internally provided with a magnetic circuit and configured to allow the flow of coolingwater. The magnetic circuit is provided parallel to the central axis of the rotary targetand has a rectangular cross-sectional shape having a long side perpendicular to the radialdirection of the rotary target.

申请人:Keihin Ramtech Co., Ltd.

地址:Kamakura-shi JP

国籍:JP

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