®ESM3045DV
NPN DARLINGTON POWER MODULE
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HIGH CURRENT POWER BIPOLAR MODULEVERY LOW Rth JUNCTION CASE
SPECIFIED ACCIDENTAL OVERLOADAREAS
ULTRAFAST FREEWHEELING DIODE FULLY INSULATED PACKAGE (ULCOMPLIANT)
EASY TO MOUNT
LOW INTERNAL PARASITIC INDUCTANCE
INDUSTRIAL APPLICATIONS: sMOTOR CONTROL sSMPS & UPS
sDC/DC & DC/AC CONVERTERSsWELDING EQUIPMENT
ISOTOPINTERNAL SCHEMATIC DIAGRAMABSOLUTE MAXIMUM RATINGS
SymbolVCEVVEBOICICMIBIBMPtotVisolTstgTjParameterCollector-Emitter Voltage (VBE = -5 V)Emitter-Base Voltage (IC = 0)Collector CurrentCollector Peak Current (tp = 10 ms)Base CurrentBase Peak Current (tp = 10 ms)Total Dissipation at Tc = 25 CInsulation Withstand Voltage (RMS) from AllFour Terminals to Exernal Heatsink Storage TemperatureMax. Operating Junction TemperatureoValue600450724362.551252500-55 to 150150UnitVVVAAAAWVooVCEO(sus)Collector-Emitter Voltage (IB = 0)CCSeptember 2003 1/8
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ESM3045DV
THERMAL DATA
Rthj-caseRthj-caseRthc-hThermal Resistance Junction-case (transistor) MaxThermal Resistance Junction-case (diode) MaxThermal Resistance Case-heatsink With Conductive Grease Applied Max120.05oooC/WC/WC/WELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
SymbolICER #ICEV #IEBO #ParameterCollector Cut-offCurrent (RBE = 5 Ω)Collector Cut-offCurrent (VBE = -5)Emitter Cut-off Current(IC = 0)Test ConditionsVCE = VCEVVCE = VCEV Tj = 100 oCVCE = VCEVVCE = VCEV Tj = 100 oC VEB = 5 VIC = 0.2 A L = 25 mH Vclamp = 450 VIC = 20 A VCE = 5 VIC = 15 A IB = 0.3 AIC = 15 A IB = 0.3 A Tj = 100 oCIC = 20 A IB = 1.2 AIC = 20 A IB = 1.2 A Tj = 100 oCIC = 20 A IB = 1.2 AIC = 20 A IB = 1.2 A Tj = 100 oCVCC = 300 V RC = 0 tp = 3 µsIB1 = 0.45 A Tj = 100 oCVCC = 300 V RC = 20 ΩIB1 = 0.45 A Tj = 100 oCVCC = 300 V RC = 20 ΩIB1 = 0.45 A Tj = 100 oCIC = 15 A VCC = 50 VVBB = -5 V RBB = 0.6 ΩVclamp = 450 V IB1 = 0.3 AL = 0.17 mH Tj = 100 oCICWoff = 24 A IB1 = 1.2 AVBB = -5 V VCC = 50 VL = 0.1 mH RBB = 0.6 ΩTj = 125 oC IF = 20 A Tj = 100 oCVCC = 200 V IF = 20 AdiF/dt = -125 A/µs L < 0.05 µHTj = 100 oC 450125450Min.Typ.Max.1.5171121UnitmAmAmAmAmAVVCEO(SUS)*Collector-EmitterSustaining Voltage(IB = 0)hFE∗VCE(sat)∗DC Current GainCollector-EmitterSaturation Voltage1201.21.31.41.62.12.11604.58223VVVVVVA/µsVVBE(sat)∗diC/dtVCE(3µs)••VCE(5µs)••tstftcVCEWBase-EmitterSaturation VoltageRate of Rise ofOn-state CollectorCollector-EmitterDynamic VoltageCollector-EmitterDynamic VoltageStorage TimeFall TimeCross-over TimeMaximum CollectorEmitter VoltageWithout SnubberDiode Forward VoltageReverse RecoveryCurrent 2.54.5V2.10.150.540.41.2µsµsµsVVF∗IRM1.711214VA∗ Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %# See test circuits in databook introduction
To evaluate the conduction losses of the diode use the following equations:VF = 1.47 + 0.0026 IF P = 1.47 IF(AV) + 0.0026 I2F(RMS)
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ESM3045DV
Safe Operating Areas
Thermal Impedance
Derating Curve
Collector-emitter Voltage Versusbase-emitter Resistance
Collector Emitter Saturation Voltage Base-Emitter Saturation Voltage
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ESM3045DV
Reverse Biased SOA
Foward Biased SOA
Reverse Biased AOAForward Biased AOA
Switching Times Inductive Load
Switching Times Inductive Load VersusTemperature
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ESM3045DV
Dc Current Gain
Typical VF Versus IF
Peak Reverse Current Versus diF/dtTurn-on Switching Test Circuit
Turn-on Switching Waveforms
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ESM3045DV
Turn-on Switching Test Circuit
Turn-off Switching Waveforms
Turn-off Switching Test Circuit of DiodeTurn-off Switching Waveform of Diode
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ESM3045DV
ISOTOP MECHANICAL DATADIM.AA1BCC2DD1EE1E2GG1G2FF1PP1S14.912.63.54.14.64430.1mmMIN.11.88.97.80.751.9537.831.525.1523.8524.815.112.84.34.354.34.430.30.5860.4960.1370.1610.1810.1570.1571.185TYP.MAX.12.29.18.20.852.0538.231.725.524.15MIN.0.4650.3500.3070.0290.0761.4881.2400.9900.9380.9760.5940.5031.1690.1690.1960.1690.1731.193inchTYP.MAX.0.4800.3580.3220.0330.0801.5031.2481.0030.950P093A7/8元器件交易网www.cecb2b.com
ESM3045DV
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequencesof use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license isgranted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication aresubject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics productsare not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is a trademark of STMicroelectronics.All other names are the property of their respective owners.© 2003 STMicroelectronics – All Rights reservedSTMicroelectronics GROUP OF COMPANIESAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.http://www.st.com8/8
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