专利名称：Tape circuit board and semiconductor chip
package including the same
发明人：Dae-Woo Son,Hyoung-Chan Chang申请号：US10059661申请日：20020128
公开号：US20020104684A1公开日：20020808
专利附图：
摘要：A tape circuit board for manufacturing a fine pitch semiconductor chip package,a method for manufacturing the tape circuit board, and a semiconductor chip packageusing the tape circuit board are provided. The tape circuit board includes an insulating
base film having a first surface and a second surface. An adhesive layer is formed on thefirst surface of the base film. Further, wiring patterns are formed on the adhesive layer.Conductive bumps extend through the base film and the adhesive layer and areconnected to the wiring patterns. The conductive bumps extend above the secondsurface of the base film.
申请人：SAMSUNG ELECTRONICS CO., LTD.
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