ADM3053

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Signal and Power Isolated CAN Transceiver with Integrated Isolated DC-to-DC Converter

Preliminary Technical Data

FEATURES

Signal and power isolated CAN transceiver

isoPower integrated isolated dc-to-dc converter 5V operation on VCC

5V or 3.3V operation on VIO

Complies with ISO 11898 standard High speed data rates up to 1 Mbps

Unpowered nodes do not disturb the bus Connect 110 or more nodes on the bus Slope control for reduced EMI Thermal shutdown protection

High common-mode transient immunity: >25 kV/μs Safety and regulatory approvals (pending) UL recognition

2500 V rms for 1 minute per UL 1577 VDE Certificate of Conformity

DIN EN 60747-5-2 (VDE 0884 Rev.2): 2003-01

Industrial operating temperature range (−40°C to +85°C) Available in wide-body, 20-lead SOIC package

APPLICATIONS

CAN data buses

Industrial field networks

GENERAL DESCRIPTION

The ADM3053 is an isolated controller area network (CAN) physical layer transceiver with an integrated isolated DC-DC converter. The ADM3053 complies with the ISO 11898 standard.

The device employs Analog Devices, Inc., iCoupler® technology to combine a 2-channel isolator, a CAN transceiver and ADI’s isoPower® DC-DC converter into a single SOIC surface mount package. An on-chip oscillator outputs a pair of square

waveforms that drive an internal transformer to provide isolated power. The device is powered by a single 5V supply realizing a fully isolated CAN solution.

Rev. PrF

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

ADM3053

FUNCTIONAL BLOCK DIAGRAM

VCCVISOOUTisoPower® DC-TO-DCCONVERTEROSCILLATORRECTIFIERREGULATORVISOINVIODIGITAL ISOLATIONiCoupler®VDD2SLOPERSTxDENCODEDECODEDCANHCANLRxDDECODEENCODERVREFVGNDREF2ADM3053CANTRANSCEIVERGND1ISOLATIONGND2BARRIERLOGIC SIDEBUS SIDE

Figure 1.

The ADM3053 creates a fully isolated interface between the CAN protocol controller and the physical layer bus. It is capable of running at data-rates up to 1Mbps.

The device has current-limiting and thermal shutdown features to protect against output short circuits. The part is fully

specified over the industrial temperature range and is available in a 20-lead, wide-body SOIC package.

The ADM3053 contain isoPower technology that uses high

frequency switching elements to transfer power through the transformer. Special care must be taken during printed circuit board (PCB) layout to meet emissions standards. Refer to

Application Note AN-0971, Control of Radiated Emissions with isoPower Devices, for details on board layout considerations.

ADM3053

Preliminary Technical Data

Test Circuits ..................................................................................... 10 Circuit Description ......................................................................... 11 Signal Isolation ............................................................................ 11 Power Isolation ............................................................................ 11 Truth Tables .................................................................................. 11 Thermal Shutdown ..................................................................... 11 DC Correctness and Magnetic Field Immunity ........................... 11 Applications Information .............................................................. 13 PCB Layout ................................................................................. 13 EMI Considerations ................................................................... 13 Insulation Lifetime ..................................................................... 13 Typical applications .................................................................... 14 Outline Dimensions ....................................................................... 15 Ordering Guide .......................................................................... 15

TABLE OF CONTENTS

Features .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Specifications ..................................................................................... 3 Timing Specifications .................................................................. 4 Switching Characteristics ............................................................ 4 Package Characteristics ............................................................... 6 Regulatory Information ............................................................... 6 Insulation and Safety-Related Specifications ............................ 6 VDE 0884 Insulation Characteristics (Pending) ...................... 7 Absolute Maximum Ratings ............................................................ 8 ESD Caution .................................................................................. 8 Pin Configuration and Function Descriptions ............................. 9

Rev. PrF | Page 2 of 16

Preliminary Technical Data

ADM3053

SPECIFICATIONS

All voltages are relative to their respective ground; 4.5 V ≤ VCC ≤ 5.5 V; 3.0 V≤ VIO ≤ 5.5 V. All minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 5 V, unless otherwise noted. Table 1.

Parameter Symbol Min Typ Max Unit Test Conditions SUPPLY CURRENT Logic Side isoPower Current Recessive State ICC 29 mA RL = 60 Ω, RS = low, see Figure 9 Dominant State ICC 195 mA RL = 60 Ω, RS = low, see Figure 9 TxD/RxD Data Rate 1 Mbps ICC 139 mA RL = 60 Ω, RS = low, see Figure 9 Logic side iCoupler Current TxD/RxD Data Rate 1 Mbps IIO 2.5 mA DRIVER Logic Inputs Input Voltage High VIH 0.7 VIO V Output recessive Input Voltage Low VIL 0.25 VIO V Output dominant CMOS Logic Input Currents IIH, IIL 500 μA TxD Differential Outputs Recessive Bus Voltage VCANL, VCANH 2.0 3.0 V TxD = high, RL = ∞, see Figure 6 CANH Output Voltage VCANH 2.75 4.5 V TxD = low, see Figure 6 CANL Output Voltage VCANL 0.5 2.0 V TxD = low, see Figure 6 Differential Output Voltage VOD 1.5 3.0 V TxD = low, RL = 45 Ω, see Figure 6 VOD −500 +50 mV TxD = high, RL = ∞, see Figure 6Short-Circuit Current, CANH ISCCANH −200 mA VCANH = −5 V Short-Circuit Current, CANH ISCCANH −100 mA VCANH = −36 V Short-Circuit Current, CANL ISCCANL 200 mA VCANL = 36 V Recessive Bus Voltage VCANL, VCANH 2.0 3.0 V TxD = high, RL = ∞, see Figure 6 RECEIVER Differential Inputs Differential Input Voltage Recessive VIDR −1.0 +0.5 V −7 V < VCANL, VCANH < 12 V, see Figure 7,

CL = 15 pF

Differential Input Voltage Dominant VIDD 0.9 5.0 V −7 V < VCANL, VCANH < 12 V, see Figure 7,

CL = 15 pF

Input Voltage Hysteresis VHYS 150 mV See Figure 4 CANH, CANL Input Resistance RIN 5 25 kΩ Differential Input Resistance RDIFF 20 100 kΩ Logic Outputs Output Low Voltage VOL 0.2 0.4 V IOUT = 1.5 mA Output High Voltage VOH VIO− 0.3 VIO− 0.2 V IOUT = −1.5 mA Short Circuit Current IOS 7 85 mA VOUT = GND1 or VIO VOLTAE REFERENCE Reference Output Voltage VREF 2.025 3.025 V |IREF = 50 μA| COMMON-MODE TRANSIENT IMMUNITY1 25 kV/μs VCM = 1 kV, transient magnitude = 800 V SLOPE CONTROL Current for Slope Control Mode ISLOPE −10 −200 μA Slope Control Mode Voltage VSLOPE 1.8 3.3 V

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ADM3053

Preliminary Technical Data

CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.

TIMING SPECIFICATIONS

All voltages are relative to their respective ground; 3.0 V ≤ VIO ≤ 5.5 V; 4.5 V ≤ VCC ≤ 5.5 V. TA = −40°C to 85°C, unless otherwise noted. Table 2.

Parameter Symbol Min Typ Max Unit Test Conditions DRIVER Maximum Data Rate 1 Mbps Propagation Delay from TxD On to Bus Active tonTxD 90 ns RS = 0 Ω; see Figure 2 and Figure 8,

RL = 60 Ω, CL = 100 pF

Propagation Delay from TxD Off to Bus Inactive toffTxD 120 ns RS = 0 Ω ; see Figure 2 and Figure 8,

RL = 60 Ω, CL = 100 pF

RECEIVER Propagation Delay from TxD On to Receiver Active tonRxD 200 ns RS = 0 Ω; see Figure 2 630 ns RS = 47 kΩ; see Figure 2 Propagation Delay from TxD Off to Receiver Inactive toffRxD 250 ns RS = 0 Ω; see Figure 2 480 ns RS = 47 kΩ; see Figure 2 Bus dominant to RxD Low 1 μs See Figure 3 CANH, CANL SLEW RATE |SR| 7 V/μs RS = 47 kΩ

SWITCHING CHARACTERISTICS

VIO0.7VIOVTxD0V0.25VIOVOD0.9VVDIFFVORVDIFF=VCANH-VCANL0.5VtonTxDtoffTxDVIOVRxD0V0.4VV - 0.3VIOtonRxDtoffRxD

Figure 2. Driver Propagation Delay, Rise/Fall Timing

Rev. PrF | Page 4 of 16

Preliminary Technical Data

ADM3053

1.5VVDIFF0VVDIFF=VCANH-VCANLtdRxDLVIOVRxD0V

Figure 3. Bus Dominant to RxDL

VRXDHIGHLOWVHYS0.50.9Figure 4. Receiver input Hysteresis

VID(V)

Rev. PrF | Page 5 of 16

ADM3053

Preliminary Technical Data

PACKAGE CHARACTERISTICS

Table 3.

Parameter Symbol Min Typ Max Unit Test Conditions Resistance (Input-Output)1 RI-O 1012 Ω Capacitance (Input-Output)1 CI-O 3 pF f = 1 MHz Input Capacitance2 CI 4 pF

Device considered a 2-terminal device: Pin 1 to Pin 8 shorted together and Pin 9 to Pin 16 shorted together. Input capacitance is from any input data pin to ground.

REGULATORY INFORMATION

Table 4. Pending ADM3053E Approvals

Organization Approval Type UL To be recognized under the Component

Recognition Program of Underwriters Laboratories, Inc.

VDE To be certified according to DIN EN 60747-5-2

(VDE 0884 Rev.2): 2003-01

Notes

In accordance with UL 1577, each ADM3053 is proof tested by applying an insulation test voltage ≥2500 V rms for 1 second. In accordance with VDE 0884-2

INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 5.

Parameter Symbol Value Unit Conditions Rated Dielectric Insulation Voltage 2500 V rms 1-minute duration Minimum External Air Gap (Clearance) L(I01) >8.0 mm Measured from input terminals to output terminals,

shortest distance through air

Minimum External Tracking L(I02) >8.0 mm Measured from input terminals to output terminals, (Creepage) shortest distance along body Minimum Internal Gap (Internal 0.017 min mm Insulation distance through insulation Clearance)

Tracking Resistance (Comparative CTI >175 V DIN IEC 112/VDE 0303-1 Tracking Index) Isolation Group IIIa Material Group (DIN VDE 0110: 1989-01, Table 1).

Rev. PrF | Page 6 of 16

Preliminary Technical Data

ADM3053

VDE 0884 INSULATION CHARACTERISTICS (PENDING)

This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by means of protective circuits. Table 6.

Description Conditions Symbol Characteristic Unit CLASSIFICATIONS Installation Classification per DIN VDE 0110 for Rated Mains Voltage ≤150 V rms I to IV ≤300 V rms I to III ≤400 V rms I to II Climatic Classification 40/85/21 Pollution Degree DIN VDE 0110, see Table 3 2 VOLTAE Maximum Working Insulation Voltage VIORM 424 VPEAK Input-to-Output Test Voltage VPR Method b1 VIORM × 1.875 = VPR, 100% production tested, 795 VPEAK

tm = 1 sec, partial discharge < 5 pC

Highest Allowable Overvoltage (Transient overvoltage, tTR = 10 sec) VTR 4000 VPEAK SAFETY-LIMITING VALUES Maximum value allowed in the event of a

failure.

Case Temperature TS 150 °C Input Current IS, INPUT 265 mA Output Current IS, OUTPUT 335 mA Insulation Resistance at TS VIO = 500 V RS >109 Ω

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ADM3053

Preliminary Technical Data

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. All voltages are relative to their respective ground. Table 7.

Parameter VCC VIO

Digital Input Voltage, TxD Digital Output Voltage, RxD CANH, CANL

Operating Temperature Range Storage Temperature Range

ESD (Human Body Model) on CANH and CANL Pins

Lead Temperature Soldering (10 sec) Vapor Phase (60 sec) Infrared (15 sec) θJA Thermal Impedance TJ Junction Temperature

Rating

−0.5 V to +6 V –0.5 V to +6 V

–0.5 V to VIO + 0.5 V –0.5 V to VIO + 0.5 V –36 V to +36 V –40°C to +85°C –55°C to +150°C TBD

300°C 215°C 220°C TBD TBD

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

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Preliminary Technical Data

ADM3053

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

GND112345201918GND2VISOINRSCANHGGGGGG

NCGND1RXDTXDVIOGND1VCCGND1GND116GND2TOP VIEW6(Not to Scale)15CANL714VREF8910131211ADM305317GND2GND200000-000VISOOUTNOTES1. PIN 19AND PIN 12 MUST BE CONNECTED EXTERNALLYG

Figure 5. Pin Configuration

Table 8. Pin Function Descriptions

Pin No. Mnemonic 1 ND1 2 NC 3 ND1 4 RXD 5 TXD 6 VIO 7 ND1 8 VCC 9 ND1 10 ND1 11 ND2 12 VISOOUT 13 ND2 14 VREF 15 CANL 16 ND2 17 CANH 18 RS 19 VISOIN 20 ND2

Description

Ground, Logic Side. No Connect.

Ground, Logic Side. Receiver Output Data. Driver Input Data.

iCoupler Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 3 and Pin 6. Ground, Logic Side.

isoPower Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted between Pin 8 and Pin 9. Ground, Logic Side. Ground, Logic Side. Ground, Bus Side.

Isolated Power Supply Output. This pin must be connected externally to VISOIN. It is recommended that a reservoir capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 12 and Pin 11. Ground (Bus Side).

Reference voltage output

Low-Level CAN Voltage Input/Output. Ground (Bus Side).

High-Level CAN Voltage Input/Output. Slope Resistor Input.

Isolated Power Supply Input. This pin must be connected externally to VISOOUT. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 19 and Pin 20. Ground (Bus Side).

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ADM3053

Preliminary Technical Data

TEST CIRCUITS

TxDVODVCANHRL2RL2VOCCANHTxDRLCANLVCANLFigure 6. Driver Voltage Measurement

CLCANHVIDCANLCLRxDRxD15pF

Figure 7. Receiver Voltage Measurements

Figure 8. Switching Characteristics Measurements

VCCisoPower® DC-TO-DCCONVERTEROSCILLATORVISOOUTRECTIFIERREGULATORVISOIN10µF100nFVIOVDD2SLOPEDECODEDIGITAL ISOLATIONiCoupler®TxDENCODERSRSCANHRLDRxDDECODEENCODERVREFGND2CANLVREFADM3053GND1ISOLATIONBARRIERGND2CANTRANSCEIVERLOGIC SIDEBUS SIDE

Figure 9. Supply Current Measurement Test Circuit

Rev. PrF | Page 10 of 16

Preliminary Technical Data

ADM3053

CIRCUIT DESCRIPTION

SIGNAL ISOLATION

Table 11. Receiving

Supply Status VIO VCC On On On On On On On On Off On On Off Inputs

VID = CANH − CANL ≥ 0.9V ≤ 0.5V 0.5V < VID < 0.9V Inputs open X X

Output

Bus State RxD Dominant L Recessive H X I Recessive H X I X H

The ADM3053 signal isolation is implemented on the logic side of

the interface. The part achieves signal isolation by having a digital isolation section and a transceiver section (see Figure 1).

LData applied to the TxD pin referenced to logic ground (GND1)

are coupled across an isolation barrier to appear at the transceiver section referenced to isolated ground (GND2).

Similarly, the single-ended receiver output signal, referenced to isolated ground in the transceiver section, is coupled across the isolation barrier to appear at the RXD pin referenced to logic ground (GND1). The signal isolation is powered by the VIO pin and allows the digital interface to 3.3V or 5V logic.

THERMAL SHUTDOWN

The ADM3053 contains thermal shutdown circuitry that protects the parts from excessive power dissipation during fault conditions. Shorting the driver outputs to a low impedance source can result in high driver currents. The thermal sensing circuitry detects the increase in die temperature under this condition and disables the driver outputs. This circuitry is designed to disable the driver outputs when a die temperature of 150°C is reached. As the device cools, the drivers are re-enabled at a temperature of 140°C.

POWER ISOLATION

The ADM3053 power isolation is implemented using an

isoPower integrated isolated dc-to-dc converter. The dc-to-dc converter section of the ADM3053 works on principles that are common to most modern power supplies. It is a secondary side controller architecture with isolated pulse-width modulation (PWM) feedback. VCC power is supplied to an oscillating circuit that switches current into a chip-scale air core transformer. Power transferred to the secondary side is rectified and

regulated to 5 V. The secondary (VISO) side controller regulates the output by creating a PWM control signal that is sent to the primary (VCC) side by a dedicated iCoupler data channel. The PWM modulates the oscillator circuit to control the power being sent to the secondary side. Feedback allows for significantly higher power and efficiency.

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

The digital signals transmit across the isolation barrier using iCoupler technology. This technique uses chip-scale transformer windings to couple the digital signals magnetically from one side of the barrier to the other. Digital inputs are encoded into waveforms that are capable of exciting the primary transformer winding. At the secondary winding, the induced waveforms are decoded into the binary value that was originally transmitted. Positive and negative logic transitions at the isolator input cause narrow (~1 ns) pulses to be sent to the decoder via the transformer. The decoder is bistable and is, therefore, either set or reset by the pulses, indicating input logic transitions. In the absence of logic transitions at the input for more than 1 μs, periodic sets of refresh pulses indicative of the correct input state are sent to ensure dc correctness at the output. If the decoder receives no internal pulses of more than approximately 5 μs, the input side is assumed to be unpowered or nonfunctional, in which case, the isolator output is forced to a default state by the watchdog timer circuit.

This situation should occur in the ADM3053 devices only during power-up and power-down operations. The limitation on the ADM3053 magnetic field immunity is set by the condition in which induced voltage in the transformer receiving coil is sufficiently large to either falsely set or reset the decoder. The following analysis defines the conditions under which this can occur.

The 3.3 V operating condition of the ADM3053 is examined because it represents the most susceptible mode of operation.

TRUTH TABLES

The truth tables in this section use the abbreviations found in Table 9.

Table 9. Truth Table Abbreviations

etter Description H High level L Low level X Don’t care Z High impedance (off)

NC Disconnected

Table 10. Transmitting

Supply Status

Input

Outputs

VIO VCC TxD Bus State CANH CAN On On L Dominant H L On On H Recessive Z Z On On Floating Recessive Z Z Off On X Recessive Z Z On Off L Indeterminate I I

Rev. PrF | Page 11 of 16

ADM3053

Preliminary Technical Data

(and is of the worst-case polarity), it reduces the received pulse from >1.0 V to 0.75 V, which is still well above the 0.5 V sensing threshold of the decoder.

The preceding magnetic flux density values correspond to specific current magnitudes at given distances from the ADM3053 transformers. Figure 11 expresses these allowable current magnitudes as a function of frequency for selected distances. As shown in Figure 11, the ADM3053 are extremely immune and can be affected only by extremely large currents operated at high frequency very close to the component. For the 1 MHz example, a 0.5 kA current must be placed 5 mm away from the ADM3053 to affect component operation.

1kMAXIMUM ALLOWABLE CURRENT (kA)The pulses at the transformer output have an amplitude of >1.0 V. The decoder has a sensing threshold of about 0.5 V, thus establishing a 0.5 V margin in which induced voltages can be tolerated. The voltage induced across the receiving coil is given by

V = (−dβ/dt)Σπrn2; n = 1, 2, … , N

where:

β is magnetic flux density (gauss).

N is the number of turns in the receiving coil.

rn is the radius of the nth turn in the receiving coil (cm). Given the geometry of the receiving coil in the ADM3053 and an imposed requirement that the induced voltage be, at most, 50% of the 0.5 V margin at the decoder, a maximum allowable magnetic field is calculated as shown in Figure 10.

100DISTANCE = 1m100MAXIMUM ALLOWABLE MAGNETIC FLUXDENSITY (kGauss)10DISTANCE = 100mm1DISTANCE = 5mm0.11010.10.0110k100k10M1MMAGNETIC FIELD FREQUENCY (Hz)100M08111-0190.0011k

Figure 11. Maximum Allowable Current for Various Current-to-ADM3053

Spacings

MAGNETIC FIELD FREQUENCY (Hz)Figure 10. Maximum Allowable External Magnetic Flux Density

For example, at a magnetic field frequency of 1 MHz, the maximum allowable magnetic field of 0.2 kgauss induces a voltage of 0.25 V at the receiving coil. This is about 50% of the sensing threshold and does not cause a faulty output transition. Similarly, if such an event occurs during a transmitted pulse

Note that in combinations of strong magnetic field and high frequency, any loops formed by printed circuit board (PCB) traces can induce error voltages sufficiently large to trigger the thresholds of succeeding circuitry. Take care in the layout of such traces to avoid this possibility.

Rev. PrF | Page 12 of 16

08111-0200.011k10k100k1M10M100MPreliminary Technical Data

ADM3053

The ADM3053 dissipate approximately TBD mW of power when fully loaded. Because it is not possible to apply

a heat sink to an isolation device, the devices primarily depend on heat dissipation into the PCB through the GND pins. If the devices are used at high ambient temperatures, provide a thermal path from the GND pins to the PCB ground plane. The board layout in Figure 12 shows enlarged pads for Pin 1, Pin 3, Pin 9, Pin 10, Pin 11, Pin 14, Pin 16, and Pin 20. Implement multiple vias from the pad to the ground plane to reduce the temperature inside the chip significantly. The dimensions of the expanded pads are at the discretion of the designer and dependent on the available board space.

APPLICATIONS INFORMATION

PCB LAYOUT

The ADM3053 signal and power isolated CAN transceiver

contains an isoPower integrated dc-to-dc converter, requiring no external interface circuitry for the logic interfaces. Power supply bypassing is required at the input and output supply pins (see Figure 12). The power supply section of the ADM3053 uses a 180 MHz oscillator frequency to pass power efficiently through its chip-scale transformers. In addition, the normal operation of the data section of the iCoupler introduces switching transients on the power supply pins.

Bypass capacitors are required for several operating frequencies. Noise suppression requires a low inductance, high frequency capacitor, whereas ripple suppression and proper regulation require a large value capacitor. These capacitors are connected between Pin 3 (GND1) and Pin 6 (VIO) for VIO and Pin 8 (VCC) and Pin 9 (GND1) for VCC. The VISOIN and VISOOUT capacitors are connected between Pin 11 (GND2) and Pin 12 (VISOOUT) and Pin 19 (VISOIN) and Pin 20 (GND2). To suppress noise and reduce ripple, a parallel combination of at least two capacitors is required. The recommended capacitor values are 0.1 μF and 10 μF. The recommended best practice is to use a very low inductance ceramic capacitor, or its equivalent, for the smaller value. The total lead length between both ends of the capacitor and the input power supply pin should not exceed 10 mm.

EMI CONSIDERATIONS

The dc-to-dc converter section of the ADM3053 must, of

necessity, operate at very high frequency to allow efficient power transfer through the small transformers. This creates high

frequency currents that can propagate in circuit board ground and power planes, causing edge and dipole radiation. Grounded enclosures are recommended for applications that use these devices. If grounded enclosures are not possible, good RF design practices should be followed in the layout of the PCB. See Application Note AN-0971, Control of Radiated Emissions with isoPower Devices, for more information.

INSULATION LIFETIME

All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period. The rate of insulation degradation is dependent on the characteristics of the voltage waveform applied across the insulation. Analog Devices conducts an extensive set of evaluations to determine the lifetime of the insulation structure within the ADM3053.

Accelerated life testing is performed using voltage levels higher than the rated continuous working voltage. Acceleration factors for several operating conditions are determined, allowing calculation of the time to failure at the working voltage of interest. The values shown in Table 6. summarize the peak voltages for 50 years of service life in several operating conditions. In many cases, the working voltage approved by agency testing is higher than the 50-year service life voltage. Operation at working voltages higher than the service life voltage listed leads to premature insulation failure.

The insulation lifetime of the ADM3053 depends on the voltage waveform type imposed across the isolation barrier. The iCoupler insulation structure degrades at different rates, depending on whether the waveform is bipolar ac, unipolar ac, or dc. Figure 13, Figure 14, and Figure 15 illustrate these different isolation voltage waveforms.

Figure 12. Recommended PCB Layout

In applications involving high common-mode transients, ensure that board coupling across the isolation barrier is minimized. Furthermore, design the board layout such that any coupling that does occur equally affects all pins on a given component side. Failure to ensure this can cause voltage differentials between pins exceeding the absolute maximum ratings for the device, thereby leading to latch-up and/or permanent damage.

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ADM3053

Preliminary Technical Data

RATED PEAK VOLTAGE08111-023Bipolar ac voltage is the most stringent environment. A 50-year operating lifetime under the bipolar ac condition determines the Analog Devices recommended maximum working voltage. In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower. This allows operation at higher working voltages while still achieving a 50-year service life. The working voltages listed in Table 6 can be applied while maintaining the 50-year minimum lifetime, provided the voltage conforms to either the unipolar ac or dc voltage cases. Any crossinsulation voltage waveform that does not conform to Figure 14 or Figure 15 should be treated as a bipolar ac waveform, and its peak voltage should be limited to the 50-year lifetime voltage value listed in Table 6.

RATED PEAK VOLTAGE0V08111-0210V

Figure 14. DC Waveform

RATED PEAK VOLTAGE08111-0220VNOTES1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATION PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE WAVEFORM VARYING BETWEEN 0 AND SOME LIMITING VALUE. THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE VOLTAGE CANNOT CROSS 0V.

Figure 15. Unipolar AC Waveform

TYPICAL APPLICATIONS

Figure 16 is an example circuit diagram using the ADM3053.

Figure 13. Bipolar AC Waveform

5V SUPPLY100nF10µF3.3V/5V SUPPLY10µF100nFVCCisoPower® DC-TO-DCCONVERTEROSCILLATORVISOOUT10nF100nFRECTIFIERVISOINREGULATORVIO100nF10nFDIGITAL ISOLATIONiCoupler®VDD2SLOPEDECODEDRSRSCANHCANHRTCANLCANCONTROLLERTxDENCODERxDDECODEENCODERVREFGND2CANLVREFBUS CONNECTORADM3053GND1LOGIC SIDEISOLATIONBARRIERGND2CANTRANSCEIVERBUS SIDE

Figure 16. Example Circuit Diagram Using the ADM3053

Rev. PrF | Page 14 of 16

Preliminary Technical Data

ADM3053

OUTLINE DIMENSIONS

13.00 (0.5118)12.60 (0.4961)20117.60 (0.2992)7.40 (0.2913)11010.65 (0.4193)10.00 (0.3937)0.30 (0.0118)0.10 (0.0039)COPLANARITY0.101.27(0.0500)BSC0.51 (0.0201)0.31 (0.0122)2.65 (0.1043)2.35 (0.0925)0.75 (0.0295)0.25 (0.0098)8°0°45°SEATINGPLANE0.33 (0.0130)0.20 (0.0079)1.27 (0.0500)0.40 (0.0157)COMPLIANTTO JEDEC STANDARDS MS-013-ACCONTROLLING DIMENSIONSARE IN MILLIMETERS; INCH DIMENSIONS(INPARENTHESES)ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FORREFERENCE ONLYANDARE NOTAPPROPRIATE FOR USE IN DESIGN.060706-A

Figure 17. 20-Lead Standard Small Outline Package [SOIC_W]

Wide Body (RW-20)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model1

ADM3053BRWZ

ADM3053BRWZ-REEL7

Temperature Range −40°C to +85°C −40°C to +85°C Package Description 20-Lead SOIC_W 20-Lead SOIC_W Package Option RW-20 RW-20

Z = RoHS Compliant Part.

Rev. PrF | Page 15 of 16

ADM3053

NOTES

Rev. PrF | Page 16 of 16

Preliminary Technical Data

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