Encapsulation of optoelectronic components

专利名称：Encapsulation of optoelectronic

components

发明人：ODD STEIJER,PAUL ERIKSEN,HANS

MOLL,JAN AKE ENGSTRAND,GORANPALMSKOG,MATS JANSON,PIA TINGHAG

申请号：AU2152695申请日：19950320公开号：AU2152695A公开日：19951009

摘要：PCT No. PCT/SE95/00281 Sec. 371 Date Jan. 28, 1997 Sec. 102(e) Date Jan. 28,1997 PCT Filed Mar. 20, 1995 PCT Pub. No. WO95/25974 PCT Pub. Date Sep. 28, 1995Anencapsulated optocomponent (1) comprises a single-crystal silicon wafer (3) andwaveguides (9) located thereon, which at least partly are manufactured by means ofprocess methods taken from the methods for manufacturing electronic integratedcircuits. The waveguides (9) extend from an edge of the optoelectronic component (1) toan optoelectronic, active or passive component (11) attached to the surface of the siliconwafer (3). Over the region for connecting the waveguides (9) to the optoelectroniccomponent (11) a transparent plastics material is molded (17), for instance an elastomer,having a refractive index adjusted to improve the optical coupling between thewaveguides (9) and the optoelectronic component (11). The molding (17) coversadvantageously all of said component (11) to also reduce thermal stresses between itand an exterior, protective layer (19) of a curable plastics material. The molded layer (17)can also cover the whole area of the waveguides (9) to form an upper cladding thereof.

Guide grooves (5) are arranged in the silicon wafer (3) for positioning guide pins (7),utilized in the connection of the optocomponent (1) to another optocomponent havingguides for guide pins and waveguides configured in the same way.

申请人：TELEFONAKTIEBOLAGET LM ERICSSON

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