ENCAPSULATION OF OPTOELECTRONIC COMPONENTS

专利名称：ENCAPSULATION OF OPTOELECTRONIC

COMPONENTS

发明人：STEIJER, Odd,ERIKSEN, Paul,MOLL,

Hans,ENGSTRAND, Jan, Ake,PALMSKOG,Göran,JANSON, Mats,TINGHAG, Pia

申请号：EP95914617.6申请日：19950320公开号：EP0750753B1公开日：20060705

摘要：An encapsulated optocomponent (1) comprises a single-crystal silicon wafer (3)and waveguides (9) located thereon, which at least partly are manufactured by means ofprocess methods taken from the methods for manufacturing electronic integratedcircuits. The waveguides (9) extend from an edge of the optoelectronic component (1) toan optoelectronic, active or passive component (11) attached to the surface of the siliconwafer (3). Over the region for connecting the waveguides (9) to the optoelectroniccomponent (11) a transparent plastics material is molded (17), for instance an elastomer,having a refractive index adjusted to improve the optical coupling between thewaveguides (9) and the optoelectronic component (11). The molding (17) coversadvantageously all of said component (11) to also reduce thermal stresses between itand an exterior, protective layer (19) of a curable plastics material. The molded layer (17)can also cover the whole area of the waveguides (9) to form an upper cladding thereof.Guide grooves (5) are arranged in the silicon wafer (3) for positioning guide pins (7),utilized in the connection of the optocomponent (1) to another optocomponent having

guides for guide pins and waveguides configured in the same way.

申请人：ERICSSON TELEFON AB L M

地址：SE

国籍：SE

代理机构：Holmberg, Martin Tor

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