ENCAPSULATION OF OPTOELECTRONIC COMPONENTS

专利名称：ENCAPSULATION OF OPTOELECTRONIC

COMPONENTS

发明人：STEIJER, Odd,ERIKSEN, Paul,MOLL,

Hans,ENGSTRAND, Jan, Ake,PALMSKOG,Göran,JANSON, Mats,TINGHAG, Pia

申请号：EP95914617.0申请日：19950320公开号：EP0750753A1公开日：19970102

摘要：The optical component (1) of encapsulation includes a silicon single crystalwafer (3) and waveguide disposed thereon (9), and in this way at least partially by meansof the method for being derived from technique manufacture, this method is formanufacturing electronic integrated circuit. The edge of waveguide (9) extends opto-electronic device (1) and arrives photoelectricity, and active or passive component (11) isconnected to silicon chip surface (3). On the area, be made of transparent plastic materialfor connecting waveguide (9) with photoelectron subassembly (11) (17), for example,elastomer there is refractive index to adjust between improving optical coupling

waveguide (9) and above-mentioned optoelectronic component (11). Moulded parts (17)advantageously covers all components (11), to reduce thermal stress simultaneously, initself and outside, the curable plastic material of protective layer (19). The molded layer(17) can also cover entire waveguide (9) and be formed in upper clad layer. For guidegroove (5) in silicon wafer (3) for using in orientation direction pin (7), which arrivesanother optical element, which has for the guidance pin of waveguide configuration and

identical.

申请人：TELEFONAKTIEBOLAGET LM ERICSSON

地址：126 25 Stockholm SE

国籍：SE

代理机构：Rosenquist, Per Olof

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