专利名称：Multi-chip-module
发明人：HOENLEIN, WOLFGANG, DR.,LEHMANN,
VOLKER, DR.
申请号：EP93108381.0申请日：19930524公开号：EP0573838A2公开日：19931215
专利附图：
摘要：The multi-chip module comprises a substrate (21) of monocrystalline silicon,whose surface is enlarged, at least in part, by anodic, electrochemical etching in afluoride-containing acidic electrolyte. Arranged on the enlarged surface of the substrate(21) there is at least one capacitor (23) which comprises a dielectric layer and a conductivelayer, the substrate (21) and the conductive layer acting as capacitor electrodes.
申请人：SIEMENS AKTIENGESELLSCHAFT
地址：WITTELSBACHERPLATZ 2; D-80333 MUENCHEN,Wittelsbacherplatz 2 D-80333
München DE
国籍：DE
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