MOLD, METHOD OF PRODUCING MOLD, PRODUCTION APPARAT

专利名称：MOLD, METHOD OF PRODUCING MOLD,

PRODUCTION APPARATUS, AND METHODOF MANUFACTURING SEMICONDUCTORDEVICE

发明人：Yongfang Li,Hiroyuki FUJITA申请号：US15693096申请日：20170831

公开号：US20180143530A1公开日：20180524

专利附图：

摘要：A edge electrode mold according to an embodiment includes a base having a

first main surface and one or more protruding structures disposed on the first mainsurface. The protruding structures include a protrusion projecting from the first mainsurface of the base, an edge electrode disposed at the protrusion, a no an electrolytichydrophobic film having electrolytic property and hydrophobicity disposed on the upperend surface of a protruding shape including the protrusion and the edge electrode.

申请人：Kabushiki Kaisha Toshiba,The University of Tokyo

地址：Tokyo JP,Tokyo JP

国籍：JP,JP

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