专利名称：Method for encapsulating integrated circuits发明人：Gerhard W. Poelzing申请号：US07/358313申请日：19890526公开号：US04927590A公开日：19900522
摘要：In molding integrated circuit packages voids are found in the molded plasticdue to air entrapped in the charging container. It was discovered that entrapped air canbe avoided if a portion of the preheated charge material has a higher viscosity than theremainder. Conveniently, this is achieved by preheating the preforms in a temperaturegradient and charging the hottest preforms last into the container. The pressure causesthe material at the top of the chamber to flow first, thereby expelling unwanted airthrough the runners ahead of the plastic flow. An effective implementation results fromtilting the RF electrode in the preheating apparatus.
申请人：AT&T BELL LABORATORIES
代理人：Peter V. D. Wilde
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