专利名称：OLED DEVICE PACKAGE AND PACKAGING
METHOD THEREOF, AND LIGHT-EMITTINGDEVICE
发明人：Wei QUAN,Chun Jan WANG申请号：US14436714申请日：20140902
公开号：US20160293897A1公开日：20161006
专利附图：
摘要：An OLED device package (), a packaging method thereof and a lighting-emittingdevice are provided. The OLED device package () comprises: a device substrate (), apackage substrate () bonded with the device substrate (), and an adhesive film () disposedbetween the device substrate () and the package substrate (). The device substratecomprises a base substrate () and an OLED device disposed on the base substrate (). Thepackage () further comprises: a buffer layer () disposed between the device substrate ()and the adhesive film (); A side of the buffer layer in contact with the adhesive film is anuneven surface.
申请人：BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS
TECHNOLOGY CO., LTD
地址：Beijing CN,Hefei City, Anhui CN
国籍：CN,CN
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容