专利名称：Lead frame for semiconductor device发明人：Go, Hisao, c/o Yokohama Works of申请号：EP91102764.7申请日：19910225公开号：EP0452634A1公开日：19911023
专利附图：
摘要：A lead frame (5), used for constructing a multi-core optical module or the like,includes a frame portion (5B), a plurality of a substrate portions (5A) on which electroniccircuit elements are to be mounted, and a support portion (5C) for supporting theplurality of substrate portions (5A) to the frame portion (5B). The support portion (5C)
has a plurality of separated end portions connected to the respective substrate portions(5A) at the position where a molded resin member (P) is covered, and at least two of theplurality of end portions are combined into one body to be connected to the frameportion (5B) at the position where the molded resin member (P) is not covered.
申请人：SUMITOMO ELECTRIC INDUSTRIES, LTD.
地址：5-33, Kitahama 4-chome, Chuo-ku Osaka-shi, Osaka 541 JP
国籍：JP
代理机构：Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
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