专利名称：Method of making a printed circuit board发明人：Kane, Robert Peter,Kurtz, Bruce Edward申请号：EP84401852申请日：19840919公开号：EP0138671A3公开日：19860806
专利附图：
摘要：@ The invention is a method for making an electrically conductive path on thewall of a passage through a substrate. It is especially useful for connecting electricallyconductive paths (25) on opposite sides of a circuit board (20). The method is
characterized by the steps of forming a tapered passage (21) through the substrate (20)
that connects to at least one conductive path on each side of the substrate (20), fillingthe tapered passage (21) with an electrically conductive powder (10), applying pressurewith a tapered die (30) to compact the powder (11) against the wall of the passage (21)without blocking the passage, and then heating the compacted powder (11) to atemperature that increases the conductivity and ductility of the compacted powder (11)and its adhesion to the substrate (20) without adversely affecting the shape or conditionof the substrate (20).
申请人：ALLIED CORPORATION
代理人：Brock, Peter William
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