专利名称：Led heating device发明人：戸谷 勉申请号：JP2019041103申请日：20190307公开号：JP2020143848A公开日：20200910
专利附图：
摘要：Problem to be solved: to provide led heating devices 10, 20, 30, 50 capable ofobtaining a high heating effect by using LED chips 12a and 52A with low running cost asheat sources. When the band shaped heating element 12 is energized, the LED chip 12aemits light, and the air in the case 11 is warmed by the heat generated by light
emission.The heated air is discharged from the air outlet 11b to the outside of the case11, and the air flows into the case 11 from the air inlet 11a.Since the heating element 12has a strip like shape, it can be accommodated in the case 11 by bending, bending, orwinding.As a result, many LED chips 12a can be incorporated in the case 11, and the airflow in the case 11 is complicated and the heating effect can be obtained.Diagram
申请人：株式会社ビートソニック
地址：愛知県日進市藤枝町庚申４７２番５
国籍：JP
代理人：三宅 始,有賀 昌也
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