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Method of using adhesive composition

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专利名称:Method of using adhesive composition发明人:宮本 潤,菅谷 裕治申请号:JP2018144540申请日:20180731公开号:JP6545873B1公开日:20190717

摘要:An adhesive composition which is transparent at the time of bonding and whichcan be visually judged as to whether or not it is unsealed by utilizing properties of anadhesive itself which is not accompanied by chemical change or breakage of a substratewhen peeled off I will provide a. SOLUTION: At least two kinds of thermoplastic resinshaving compatibility and melting at a predetermined heating temperature and havingmutually different refractive indexes, and being incompatible with the thermoplastic resinand having an average particle diameter of 0.3 to 20 μm And a solvent. [Selected figure]Figure 1

申请人:井和工業株式会社

地址:東京都豊島区巣鴨3丁目39番4号

国籍:JP

代理人:橋本 克彦,橋本 京子

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