专利名称：SEMICONDUCTOR DEVICE HAVING POWER
SUPPLY-SIDE AND GROUND-SIDE METALREINFORCING MEMBERS INSULATED FROMEACH OTHER
发明人：Kenichi Inaba,Minoru Yoshikawa申请号：US13388285申请日：20100820
公开号：US20120126432A1公开日：20120524
专利附图：
摘要：Provided is a semiconductor device which includes a wiring substrate; a
semiconductor chip fixedly attached to a first surface of the wiring substrate; a powersupply pad that is provided on a second surface opposite to the first surface of the wiringsubstrate, and supplies electric power to the wiring substrate; a ground pad that isprovided on the second surface of the wiring substrate and grounds the wiring substrate;a power supply-side reinforcing member that is connected to the power supply pad andmade of metal; a ground-side reinforcing member that is connected to the ground padand made of metal; and an insulating part that insulates the power supply-sidereinforcing member and the ground-side reinforcing member from each other.
申请人：Kenichi Inaba,Minoru Yoshikawa
地址：Tokyo JP,Tokyo JP
国籍：JP,JP
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