Wafer and method of cutting the same

专利名称：Wafer and method of cutting the same发明人：Chien-Yu Chen申请号：US11293086申请日：20051205

公开号：US20060292828A1公开日：20061228

专利附图：

摘要：A method of cutting a wafer. First, the first substrate and the second substrateare provided. Next, several alignment marks are formed on the backside of the secondsubstrate to form two reference coordinate axes. Then, the first substrate and thesecond substrate are assembled to form a wafer. The topside of the second substrate

faces the lower surface of the first substrate for assembly. Afterwards, the first substrateis cut for forming several first cutting marks. Then, the second substrate is cut accordingto the two reference coordinate axes, for forming several second cutting markscorresponding to the first cutting marks.

申请人：Chien-Yu Chen

地址：Kaohsiung TW

国籍：TW

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